该供应商的新产品
来自深圳卓茂科技有限公司的Bga Rework Station, Chipset Repair Machines, Bga Reballing Kit, Laptop Repair Tools, Motherboard Repair Machine, Mobile Repairing Machines, Smd Rework Station, Reballing Station, Bga Reballing Stencil由于完美的制作,大胆的色彩阵列和迷人的设计图案,正在设定业界的基准。我们的[关键字]和[主要产品]采用活泼的颜色设计,具有最先进的专业知识,使整个范围在[国家]和国外都有最佳利用率。尽管Large具有年生产能力,但整个Bga Rework Station, Chipset Repair Machines, Bga Reballing Kit, Laptop Repair Tools, Motherboard Repair Machine, Mobile Repairing Machines, Smd Rework Station, Reballing Station, Bga Reballing Stencil系列都经过精心设计。我们的[关键字]不仅具有美学上的吸引力,而且由于质量控制的生产过程也确保了长寿。您可以在23.35 Piece提供最小订单数量60 Piece的订单。买家可以保持质量和安全无忧,因为他们的订单来自Shenzhen,[州],[国家]的[关键字]的着名制造商和制造商。我们的专业人员确保顺利和快速的8-9 Business Days运输流程,订单通过FOB, CIF从中国端口处理。 T/T, PayPal开放付款,我们接受不同的货币模式,包括CNY,USD。
Condition |
New |
I Deal In |
New and Second Hand |
Input Voltage |
230V |
Machine Type |
Other |
Output Current |
Other |
业务性质
制造商/工厂
员工人数
5 - 10 People
成立年份
2006
年营业额
US$50 Million - US$100 Million
国家/地区
深圳, 中国
主要产品
Bga Rework Station, Chipset Repair Machines, Bga Reballing Kit, Laptop Repair Tools, Motherboard Rep...
法律地位
Have Own Export License
付款条件
Bank wire (T/T), Letter of Credit (L/C), MoneyGram, Western Union (WU), Cash
Shenzhen Zhuomao Technology Co., Ltd是一个以Industrial Plants, Machinery & Equipment产品闻名的大型China BGA rework station, Chipset repair machines, BGA reballing kit, Laptop repair tools, motherboard repair machine, mobile repairing machines, SMD rework station, Reballing station, BGA reballing stencils, hot-air Soldering station, reballing kit for xbox360/PS3/LCD, Laptop motherboard vga chip repair, hot air rework station. Manufacturer。 Shenzhen Zhuomao Technology Co., Ltd的工厂 位于Building A4, Donghua Industrial Park, Bao'an Road, Bao'an, Shenzhen, China Shenzhen Guangdong 518126 China。 Shenzhen Zhuomao Technology Co., Ltd是China中一个知名的组织,正在处理整体市场。 Shenzhen Zhuomao Technology Co., Ltd个人资料 名称:Leron
地址: Building A4, Donghua Industrial Park, Bao'an Road, Bao'an, Shenzhen, China Shenzhen Guangdong 518126
国家: China
主营产品: BGA rework station, Chipset repair machines, BGA reballing kit, Laptop repair tools, motherboard repair machine, mobile repairing machines, SMD rework station, Reballing station, BGA reballing stencils, hot-air Soldering station, reballing kit for xbox360/PS3/LCD, Laptop motherboard vga chip repair, hot air rework station.
成立年份: 2006
出口重点: Canada, India, Saudi Arabia, United Kingdom, United States
估计员工: 51 - 100 People
注册资本: 71% - 80% 百万美元
所有权状态: Private Limited
出口百分比: 71% - 80%
工厂规模: 10, 000-30, 000 square meters
研究团队规模: 11 - 50 People
合同服务: OEM Service Offered